ANISOTROPIC CONDUCTIVE PASTE, CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an anisotropic conductive paste easy in connection between electrodes, capable of increasing conduction reliability of a connection structure and further capable of hardly causing generation of voids in the connection structure.

SOLUTION: An anisotropic conductive paste according to the present invention includes a conductive particle 1, a binder resin and a particulate thickener. The conductive particle 1 includes a resin particle 2 and a conductive layer 3 covering the surface 2a of the resin particle 2. At least an outer surface layer of the conductive layer 3 is a solder layer 5. When a glass transition temperature of the particulate thickener is represented as Tg (°C), the particulate thickener thickens the anisotropic conductive paste at Tg°C or above.

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