发明名称 COMPRESSION AND COLD WELD SEALING METHOD AND DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide compression cold welding methods for sealing parts together, joint structures, and hermetically sealed containment devices. <P>SOLUTION: The method includes: providing a first substrate 12 having at least one first joint structure 16 which comprises a first joining surface 18, which surface comprises a first metal; providing a second substrate 14 having at least one second joint structure which comprises a second joining surface 22, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012148342(A) 申请公布日期 2012.08.09
申请号 JP20120045363 申请日期 2012.03.01
申请人 MICROCHIPS INC 发明人 COPPETA JONATHAN R;SHELTON KURT;SHEPPARD NORMAN F JR;SNELL DOUGLAS B;SANTINI CATHERINE M B
分类号 B23K20/00;A61L31/00;A61M37/00;B23K1/00;B23K1/14;B81B7/02;B81C3/00 主分类号 B23K20/00
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