发明名称 LASER BEAM MACHINING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of executing high-accuracy laser beam machining. <P>SOLUTION: The laser beam machining apparatus includes a laser oscillator 41 for generating the laser beam L, an XY scanner 47 to scan the irradiation position of the laser beam L on a workpiece W in the XY direction, a telecentric lens 48 for realizing the constant outgoing angle of the laser beam L outgoing toward the workpiece W irrespective of the angle of incidence of the laser beam L to be incident from the XY scanner 47, and an integrally formed casing frame 60 for accommodating the laser oscillator 41 and the XY scanner 47. The casing frame 60 has a partition plate 61 arranged across the outgoing optical axis of the laser oscillator 41. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012148313(A) 申请公布日期 2012.08.09
申请号 JP20110009019 申请日期 2011.01.19
申请人 KEYENCE CORP 发明人 OKAMOTO YASUSHI;IDAKA MAMORU
分类号 B23K26/04;B23K26/00;B23K26/06;B23K26/08 主分类号 B23K26/04
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