JOINING DEVICE AND METHOD, AND JOINED BODY

摘要

PROBLEM TO BE SOLVED: To provide a joining device and method which reduces the occurrence of voids caused by organic gas generated during heat melting or sintering.

SOLUTION: The heating chamber 21 of a joining device 20 is kept at a temperature lower than the boiling point of organic solvent contained in soldering paste 17. A heater 25 is made to touch the center of the element face 12a of a semiconductor device 12 for local heating. This produces a temperature gradient in the soldering paste 17 in which a temperature rise slows down toward each end 17b from the center of the soldering paste 17. Accordingly, the organic gas generated because of the vaporization of the organic solvent comes out into the atmosphere from each end 17b of the soldering paste 17 as part adjoining the atmosphere.

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