| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide many circuit boards out of a single ceramic substrate at a low cost. <P>SOLUTION: A single large ceramic substrate 11 and a metal pattern plate 12 which has almost the same size as the former and is patterned are prepared. They are joined together as shown in FIG.1(c). The metal pattern plate 12 generally consists of a circuit pattern part 12a, at the center, in which the same pattern of two vertical columns×three horizontal rows (unit pattern) is arrayed, and a peripheral part 12b present around them. In any of the circuit pattern part 12a and the peripheral part 12b, individual patterns constituting them are connected with a connection part 13 which is smaller than them. The connection part 13 can be easily cut after division by using, for example, a cutter and a nipper. Likewise, a metal heatsink plate can be formed in pattern on the rear surface of the ceramic substrate 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
