发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART
摘要 To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I) : wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.
申请公布号 EP2133743(A4) 申请公布日期 2012.08.08
申请号 EP20080721428 申请日期 2008.03.06
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. 发明人 MINEGISHI, TOMONORI;NOGITA, RIKA;IWASHITA, KENICHI
分类号 G03F7/023;C08G73/10;C08G73/22;G03F7/004;H01L21/027 主分类号 G03F7/023
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