METHOD FOR POLISHING SEMICONDUCTOR WAFER, AND DEVICE FOR POLISHING SEMICONDUCTOR WAFER

摘要

PURPOSE: An apparatus and a method for polishing a semiconductor wafer are provided to assume the progress of the polishing of the wafer from the change of the calculated standard deviation by calculating the standard deviation of a plate load current value at every regular time. CONSTITUTION: An upper plate(2) is formed to move vertically by a lifting driving part(7). The lifting driving part is controlled by a command signal from a controller(20). A lower plate(3) includes a rotary shaft(3a) rotated by a lower rotation driving part(8b). Polishing pads(4,5) are respectively formed on the upper plate and the lower plate to face each other for polishing the both sides of a wafer(W). A number of carriers(6a) supporting a number of wafers are arranged between the upper plate and the lower plate.