Method for Replacing Bad Substrate Unit in Substrate Strip
摘要
PURPOSE: A method for replacing a defective unit substrate of a substrate strip is provided to efficiently replace the defective unit substrate by using a first carrier as a supporter to bond a unit substrate without defects. CONSTITUTION: A first carrier is attached to one side of a first substrate strip(S100). The first substrate strip is separated from the edge of a defective unit substrate(S200). The first substrate strip is separated from the first carrier to remove the defective unit substrate(S300). A unit substrate without defects is combined in the position to remove the defective unit substrate of the first substrate strip(S400).
申请公布号
KR101171280(B1)
申请公布日期
2012.08.07
申请号
KR20110007498
申请日期
2011.01.25
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
BYUN, DAE JUNG;CHUNG, YUL KYO;JUNG, JIN SOO;KIM, JUNG SOO;KIM, BONG SOO