发明名称 |
Electronic module with vertical connector between conductor patterns |
摘要 |
The present invention generally relates to a new structure to be used with electronic modules such as printed circuit boards and semiconductor package substrates. Furthermore there are presented herein methods for manufacturing the same. According to an aspect of the invention, the aspect ratio of through holes is significantly improved. Aspect ratio measures a relationship of a through hole or a micro via conductor in the direction of height divided width. According to the aspect of the invention, the aspect ratio can be increased over that of the prior art solution by a factor of ten or more.
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申请公布号 |
US8238113(B2) |
申请公布日期 |
2012.08.07 |
申请号 |
US20100842052 |
申请日期 |
2010.07.23 |
申请人 |
IIHOLA ANTTI;PALM PETTERI;IMBERA ELECTRONICS OY |
发明人 |
IIHOLA ANTTI;PALM PETTERI |
分类号 |
H05K1/18;H05K7/00 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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