| 发明名称 |
THERMOPLASTIC RESIN COMPOSITION, AND MOLDED BODY OBTAINED BY MOLDING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition by which flexibility and heat resistance of a flexible film can be improved. <P>SOLUTION: The thermoplastic resin composition comprises: an inorganic compound-containing polymer (A) obtained by polymerizing a vinyl monomer (a2) in the presence of an aluminum inorganic compound (a1); and a flexible thermoplastic resin (B), wherein the thermoplastic resin composition has hardness of less than 90, as measured by a durometer D. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012144586(A) |
申请公布日期 |
2012.08.02 |
| 申请号 |
JP20110001820 |
申请日期 |
2011.01.07 |
| 申请人 |
MITSUBISHI RAYON CO LTD;TODA KOGYO CORP |
发明人 |
TAKAYAMA NOBUHISA;ABE YOSHIAKI;KATAMOTO TSUTOMU |
| 分类号 |
C08L101/00;C08F2/44;C08F292/00;C08L51/10 |
主分类号 |
C08L101/00 |
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