发明名称 COMPOSITE MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To solve the problem that in order for an isocyanate compound to form a secondary chemical bond with a metal surface, an isocyanate group of the isocyanate compound needs to come in contact with the metal surface while maintaining reactivity, but the isocyanate group of the isocyanate compound that can come in contact with the metal surface while maintaining reactivity is a portion of the mixed whole. <P>SOLUTION: A composite molding includes metal and resin. The metal carries a tin compound in at least a portion of a face bonded with the resin. The resin includes thermoplastic resin having active hydrogen and the isocyanate compound having two or more isocyanate groups in one molecule. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012145219(A) 申请公布日期 2012.08.02
申请号 JP20110209212 申请日期 2011.09.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 NAITO SHINYA;INUZUKA TAKAYUKI;HAMANO KOJI
分类号 F16C13/00 主分类号 F16C13/00
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