| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the emission surface of a laser chip from becoming contaminated by flux mixed in solder when a semiconductor laser is fixed to a base by soldering. <P>SOLUTION: The laser light source device includes a semiconductor laser 31 having a laser chip 41 which outputs laser light mounted on the top face of a mount member 52 and a base 38 provided with a semiconductor laser fitting part 53 to which the semiconductor laser is secured by soldering. The semiconductor laser fitting part has, on the top face thereof, a fitting face 72 to which a bottom face 52a of the mount member is joined via solder 71, and the semiconductor laser is installed on the semiconductor laser fitting part in such a way that the mount member overhangs like an eave. In particular, the semiconductor laser fitting part has, on the outside of the fitting face, a level difference face whose level is made to be lower than that of the fitting face. On the level difference face is formed a concavity whose upper part is open. <P>COPYRIGHT: (C)2012,JPO&INPIT |
