发明名称 RESIN SHEET, METALLIC FOIL WITH RESIN, SUBSTRATE MATERIAL, AND COMPONENT-MOUNTING SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat-dissipating resin sheet that can efficiently dissipate heat from an electric component to the outside. <P>SOLUTION: The resin sheet has at least a resin and a resin layer that contains an oxide filler. The resin layer is filled with 70-90 vol.% of oxide filler and has surface roughness Ra of 0.1-5 &mu;m. It is preferable that alumina is used as the oxide filler. The far-infrared emissivity of the resin sheet is 90% or more. The resin layer is used for a metallic foil with resin. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012144687(A) 申请公布日期 2012.08.02
申请号 JP20110030595 申请日期 2011.02.16
申请人 PANASONIC CORP 发明人 SAWADA TOMOAKI;BABA DAIZO
分类号 C08J5/18;B32B15/08;C08K3/22;C08L101/00;H05K1/03;H05K1/05 主分类号 C08J5/18
代理机构 代理人
主权项
地址