发明名称 |
RESIN SHEET, METALLIC FOIL WITH RESIN, SUBSTRATE MATERIAL, AND COMPONENT-MOUNTING SUBSTRATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-dissipating resin sheet that can efficiently dissipate heat from an electric component to the outside. <P>SOLUTION: The resin sheet has at least a resin and a resin layer that contains an oxide filler. The resin layer is filled with 70-90 vol.% of oxide filler and has surface roughness Ra of 0.1-5 μm. It is preferable that alumina is used as the oxide filler. The far-infrared emissivity of the resin sheet is 90% or more. The resin layer is used for a metallic foil with resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012144687(A) |
申请公布日期 |
2012.08.02 |
申请号 |
JP20110030595 |
申请日期 |
2011.02.16 |
申请人 |
PANASONIC CORP |
发明人 |
SAWADA TOMOAKI;BABA DAIZO |
分类号 |
C08J5/18;B32B15/08;C08K3/22;C08L101/00;H05K1/03;H05K1/05 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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