| 摘要 |
Provided is an electronic component module that suppresses occurrences of solder splashing. An electronic component module (100) is formed by an electronic component element (4), on which a plurality of pad electrodes (5) are formed, being disposed on a substrate (1), on which a plurality of substrate electrodes (2) are formed, so as to face the substrate (1), with the substrate electrodes (2) and pad electrodes (5) connected by solder bumps. Columnar electrodes (7) are formed on the pad electrodes, and in addition to the solder bumps (9) being provided on the columnar electrodes (7), ring-shaped electrodes (8) are formed on the pad electrodes (5) so as to surround the columnar electrodes (7). |
