PHOTOCURABLE RESIN COMPOSITION FOR IMPRINT LITHOGRAPHY

摘要

PURPOSE: A photocurable resin composition is provided to have excellent wettability to photocurable resin or heatcurable resin, and to have excellent chemical resistance and moldability, thereby useful for manufacturing a mold for imprint lithography. CONSTITUTION: A photocurable resin composition comprises a polyaliphatic aromatic silsesquioxane comprising ethylenically unsaturated group, a reactive monomer comprising one or more unsaturated groups in a molecule, an organic silane based compound, and a photoinitiator. A manufacturing method of an imprint mold comprises a step of spreading the photocurable resin composition(102a) on one side of a disk mold with formed pattern, and manufacturing a cured polymer resin in which pattern of the disk mold is formed by curing the spread composition; a step of detaching the cured polymer resin from the disk mold.