发明名称 METHOD FOR TREATING METAL FILM AND TREATMENT DEVICE
摘要 A method for treating a metal film that utilizes a gas cluster beam to treat a metal film (72) formed on a surface of an object to be treated (W). A gas cluster beam is formed by adiabatically expanding a mixed gas comprising an oxidation gas for forming an oxide by oxidizing the elements of the metal film, a complexing gas for forming an organic metal complex by reacting with the oxide, and a rare gas; and the gas cluster beam is used to bombard the metal film of the object to be treated in order to etch the metal film.
申请公布号 WO2012102139(A1) 申请公布日期 2012.08.02
申请号 WO2012JP50869 申请日期 2012.01.17
申请人 TOKYO ELECTRON LIMITED;GUNJI, ISAO;MIYOSHI, HIDENORI;HARA, KENICHI 发明人 GUNJI, ISAO;MIYOSHI, HIDENORI;HARA, KENICHI
分类号 H01L21/302;C23F4/00;H01J27/02;H01J37/317;H01L21/3213 主分类号 H01L21/302
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