发明名称 |
METHOD FOR TREATING METAL FILM AND TREATMENT DEVICE |
摘要 |
A method for treating a metal film that utilizes a gas cluster beam to treat a metal film (72) formed on a surface of an object to be treated (W). A gas cluster beam is formed by adiabatically expanding a mixed gas comprising an oxidation gas for forming an oxide by oxidizing the elements of the metal film, a complexing gas for forming an organic metal complex by reacting with the oxide, and a rare gas; and the gas cluster beam is used to bombard the metal film of the object to be treated in order to etch the metal film. |
申请公布号 |
WO2012102139(A1) |
申请公布日期 |
2012.08.02 |
申请号 |
WO2012JP50869 |
申请日期 |
2012.01.17 |
申请人 |
TOKYO ELECTRON LIMITED;GUNJI, ISAO;MIYOSHI, HIDENORI;HARA, KENICHI |
发明人 |
GUNJI, ISAO;MIYOSHI, HIDENORI;HARA, KENICHI |
分类号 |
H01L21/302;C23F4/00;H01J27/02;H01J37/317;H01L21/3213 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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