PRE-PREG, LAMINATE BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

摘要

This pre-preg (40) is formed by impregnating a woven fiber constituted of strands with a resin composition. In this pre-preg, silica particles are present in the strands. This makes it possible to obtain a pre-preg having a superior ability for woven fiber to be impregnated with the resin composition. It is further possible to use this pre-preg and/or a metal-clad laminate board produced using this pre-preg to produce a printed wiring board and a semiconductor device.