发明名称 Paste composition and printed circuit board
摘要 A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1).
申请公布号 EP2482624(A1) 申请公布日期 2012.08.01
申请号 EP20110194134 申请日期 2011.12.16
申请人 NITTO DENKO CORPORATION 发明人 EBE, HIROFUMI;INOUE, SHINICHI;FURUKAWA, YOSHIHIRO
分类号 H05K1/05;C08K5/3475;H05K1/03 主分类号 H05K1/05
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