发明名称 |
Paste composition and printed circuit board |
摘要 |
A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1). |
申请公布号 |
EP2482624(A1) |
申请公布日期 |
2012.08.01 |
申请号 |
EP20110194134 |
申请日期 |
2011.12.16 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
EBE, HIROFUMI;INOUE, SHINICHI;FURUKAWA, YOSHIHIRO |
分类号 |
H05K1/05;C08K5/3475;H05K1/03 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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