发明名称 WRAP-AROUND CONTACTS FOR FINFET AND TRI-GATE DEVICES
摘要 A semiconductor device comprises a substrate and a semiconductor body formed on the substrate. The semiconductor body comprises a source region; and a drain region. The source region or the drain region, or combinations thereof, comprises a first side surface, a second side surface, and a top surface. The first side surface is opposite the second side surface, the top surface is opposite the bottom surface. The source region or the drain region, or combinations thereof, comprise a metal layer formed on the substantially all of the first side surface, substantially all of the second side surface, and the top surface.
申请公布号 KR20120085928(A) 申请公布日期 2012.08.01
申请号 KR20127016105 申请日期 2010.12.02
申请人 INTEL CORPORATION 发明人 CEA STEPHEN M.;MEHANDRU RISHABH;SHIFREN LUCIAN;KUHN KELIN
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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