| 摘要 |
<p>PROVIDED IS A CONDENSER MICROPHONE (100). THE CONDENSER MICROPHONE INCLUDES : A SUBSTRATE (180) DISPOSED ON A MICRO ELECTRON MECHANICAL SYSTEM (MEMS) MICROPHONE CHIP (130) AND A CIRCUIT PART (150) ; A PACKAGE (120) HAVING A RING SHAPE AND DISPOSED ON THE SUBSTRATE, THE PACKAGE SURROUNDING THE MEMES MICROPHONE CHIP AND THE CIRCUIT PART ; AN INSERTION PART (140) HAVING A RING SHAPE AND FORMED OF A CONDUCTIVE MATERIAL, THE INSERTION PART BEING ATTACHED TO AN INNER WALL OF THE PACKAGE; AND AN UPPER PLATE (110) COMPLETELY COVERING THE PACKAGE , THE UPPER PLATE HAVING AN ACOUSTIC HOLE (111) THROUGH WHICH SOUND PASSES. IN ADDITION, THE CONDENSER MICROPHONE (300), INCLUDES : A SUBSTRATE (380) DISPOSED ON A MEMS MICROPHONE CHIP (333) AND A CIRCUIT PART (350); A PACKAGE (320) DISPOSED ON THE SUBSTRATE AND COVERING THE MEMS MICROPHONE CHIP AND THE CIRCUIT PART, THE PACKAGE HAVING AN ACOUSTIC HOLE (310) THROUGH WHICH SOUND PASSES; AND AN INSERTION PART ATTACHED TO AN INNER WALL OF THE PACKAGE, THE INSERTION PART (340) BEING FORMED OF A CONDUCTIVE MATERIAL.</p> |
