| 摘要 |
PURPOSE: A polishing method and a polishing apparatus are provided to polish an unpolished surface using a polishing pad while controlling temperature of the polishing pad by spraying gas to the polishing pad. CONSTITUTION: A polishing state of an unpolished surface is monitored while a gas injection direction or flow rate is controlled by PID(Proportion, Integration, and Differentiation) during polishing. Control temperature of a polishing pad(14) is changed If the polishing state reaches a predetermined thickness of an unpolished film. Dry gas is used before the polishing state reaches to the predetermined film thickness. Mist is used when the polishing state reaches the predetermined film thickness. |
