发明名称 |
METAL PATTERN FORMING METHOD FOR FORMING METAL PATTERN ON SUBSTRATE AND SUBSTRATE MANUFACTURED BY THE SAME |
摘要 |
PURPOSE: A method for forming a metal pattern on a substrate and the substrate manufactured by the same are provided to reduce manufacturing costs and time by removing an etching process. CONSTITUTION: An upper surface of a substrate(10) is processed by an RIE(Reactive Ion Etching). A mask pattern(11) is formed on the processed upper surface of the substrate. A metal thin film layer(12a,12b) is formed on the upper surface of the mask pattern. The metal thin film layer is removed from the upper surface of the mask pattern.
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申请公布号 |
KR20120084448(A) |
申请公布日期 |
2012.07.30 |
申请号 |
KR20110005814 |
申请日期 |
2011.01.20 |
申请人 |
KOREA POLYTECHNIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION |
发明人 |
LEE, SEONG EUI;HAN, DA SOL;LEE, JAE YUN |
分类号 |
H05K3/18;H05K3/06 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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