发明名称 METAL PATTERN FORMING METHOD FOR FORMING METAL PATTERN ON SUBSTRATE AND SUBSTRATE MANUFACTURED BY THE SAME
摘要 PURPOSE: A method for forming a metal pattern on a substrate and the substrate manufactured by the same are provided to reduce manufacturing costs and time by removing an etching process. CONSTITUTION: An upper surface of a substrate(10) is processed by an RIE(Reactive Ion Etching). A mask pattern(11) is formed on the processed upper surface of the substrate. A metal thin film layer(12a,12b) is formed on the upper surface of the mask pattern. The metal thin film layer is removed from the upper surface of the mask pattern.
申请公布号 KR20120084448(A) 申请公布日期 2012.07.30
申请号 KR20110005814 申请日期 2011.01.20
申请人 KOREA POLYTECHNIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION 发明人 LEE, SEONG EUI;HAN, DA SOL;LEE, JAE YUN
分类号 H05K3/18;H05K3/06 主分类号 H05K3/18
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