发明名称 ELECTRONIC COMPONENT MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component module which has a small shield case having good characteristics. <P>SOLUTION: An electronic component module has a substrate, a chip component having two or more electrode terminals installed on the substrate, and a shield case which connects with the substrate so as to cover the chip component and is grounded. One of the electrode terminals of the chip component, which is grounded, is connected with the shield case, and the other electrode terminal is connected with the substrate. The above problem is solved by providing the electronic component module. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142470(A) 申请公布日期 2012.07.26
申请号 JP20110000161 申请日期 2011.01.04
申请人 FUJITSU COMPONENT LTD 发明人 MURAMATSU SUSUMU
分类号 H05K1/18;H05K9/00 主分类号 H05K1/18
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