| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a paste for mounting a semiconductor device which has a uniform particle size and exhibits excellent dispersibility to resins. <P>SOLUTION: The paste for mounting a semiconductor device is composed of polyorganosiloxane particles having an average particle size in the range of 0.5-30 μm, a particle size variation coefficient (CV value) of 3% or less, and a content in the range of 30-90 wt%, and one or more than one kind selected from epoxy resin, polyimide resin, bismaleimide resin, acrylic resin, methacryl resin, silicon resin, BT resin, and cyanate resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
