| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive polyimide precursor having a small coefficient of thermal expansion and residual stress, excellent adhesiveness to a copper substrate or the like, and high fracture strength of a resin produced from the precursor, and to provide a photosensitive resin composition. <P>SOLUTION: The photosensitive polyimide precursor has a repeating unit (1) obtained by polymerization condensation of a tetracarboxylic acid and an aromatic diamine and has an actinic ray-functional group at both terminals. The photosensitive polyimide precursor contains an aromatic tetracarboxylic acid having a rigid structure by 70 to 100 mol% with respect to the whole molar number of the tetracarboxylic acid. The aromatic diamine contains a thiophene-containing aromatic diamine and an aromatic diamine with a rigid structure by a molar ratio of 3:97 to 30:70. The actinic ray functional group comprises a phenyl amino group having a carbon-carbon double bond or a dicarboxyphenylcarbonyl group having a carbon-carbon double bond as an ester. The photosensitive resin composition contains the above precursor. <P>COPYRIGHT: (C)2012,JPO&INPIT |
