发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 A printed circuit board (PCB) according to an exemplary aspect of the present invention includes a plate-like member, a power supply circuit, a power supply line, and a ground line. The plate-like member has a surface on which a semiconductor device is mounted. The power supply circuit is embedded in the plate-like member in a region in which the semiconductor device is mounted, and outputs a power supply voltage and a ground voltage. The power supply line is formed in the plate-like member between the semiconductor device and the power supply circuit, and supplies the power supply voltage output from the power supply circuit to the semiconductor device. The ground line is formed in the plate-like member between the semiconductor device and the power supply circuit, and supplies the ground voltage output from the power supply circuit to the semiconductor device.
申请公布号 US2012188729(A1) 申请公布日期 2012.07.26
申请号 US201213355008 申请日期 2012.01.20
申请人 NAKANO TOSHIHIKO;NEC CORPORATION 发明人 NAKANO TOSHIHIKO
分类号 H05K1/00;H05K3/10 主分类号 H05K1/00
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