INDEPENDENTLY PACKAGED BRIDGE TYPE MAGNETIC FIELD SENSOR

摘要

The invention relates to a bridge type magnetic field sensor which utilizes a magnetic tunnel junction. The bridge type magnetic field sensor is mainly composed of one half-bridge magnetic tunnel junction sensor chip or several whole-bridge magnetic tunnel junction sensor chips packaged within a semiconductor chip. In each sensing direction, two sensor chips are arranged in the direction of a sensing axis along a packaged lead frame, and are mutually anti-parallel to form a push-pull structure. Then, the sensor chips are interconnected by the method of lead bonding. The chips can be bonded to many types of standard packaged semiconductor lead frames via leads, and can be packaged as a low cost form of standard semiconductor packaging. The design does not need any reference resistance for shielding the magnetic field.