发明名称 LIGHT-MIXING MULTICHIP PACKAGE STRUCTURE
摘要 A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.
申请公布号 US2012187865(A1) 申请公布日期 2012.07.26
申请号 US201113069276 申请日期 2011.03.22
申请人 CHUNG CHIA-TIN;DAI SHIH-NENG;WU CHAO-CHIN;PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO.,LTD. 发明人 CHUNG CHIA-TIN;DAI SHIH-NENG;WU CHAO-CHIN
分类号 H05B37/02;F21V9/16 主分类号 H05B37/02
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