WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME

摘要

This wiring substrate is characterized by being provided with a substrate main body (12o) on which bonding pads (12b) are arranged and a rectangular die pad (12a) formed on the substrate main body (12o) and by the die pad (12a) being provided with special shaped parts (P1, P2, P3) formed so as to protrude on two sides opposite to each other on at least two corners in a direction (Y) in which the bonding pads (12b) are not arranged.