发明名称 |
AIR-DIELECTRIC FOR SUBTRACTIVE ETCH LINE AND VIA METALLIZATION |
摘要 |
A method and structure is disclosed whereby multiple interconnect layers having effective air gaps positioned in regions most susceptible to capacitive coupling can be formed. The method includes providing a layer of conductive features, the layer including at least two line members disposed on a substrate and spaced from one another by less than or equal to an effective distance, and at least one such line member also having a via member extending away from the substrate, depositing a poorly conformal dielectric coating to form an air gap between such line members, and exposing a top end of the via.
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申请公布号 |
US2012187566(A1) |
申请公布日期 |
2012.07.26 |
申请号 |
US201113013108 |
申请日期 |
2011.01.25 |
申请人 |
HORAK DAVID V.;HUANG ELBERT;KOBURGER, III CHARLES W.;PONOTH SHOM;YANG CHIH-CHAO;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HORAK DAVID V.;HUANG ELBERT;KOBURGER, III CHARLES W.;PONOTH SHOM;YANG CHIH-CHAO |
分类号 |
H01L23/522;H01L21/768 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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