摘要 |
In one example, a composite processor (100) includes a circuit board (1200), a first processor element package (1230), and a second processor element package (1240). The circuit board has an optical link (1211) and an electrical link (1221). The first processor element package (1230) includes a substrate (1231) with an integrated circuit (240), a sub-wavelength grating optical coupler (1232), and an electrical coupler (1233) coupled to the electrical link (1221) of the circuit board (1200). The second processor element package (1240) includes a substrate (1241) with an integrated circuit (240), a sub-wavelength grating optical coupler (1242), and an electrical coupler (1243) coupled to the electrical link (1221) of the circuit board (1220). The sub-wavelength grating optical coupler (1232) of the first processor element package (1230), the optical link (1211) of the circuit board (1220), and the sub-wavelength grating optical coupler (1242) of the second processor element package (1240) collectively define an optical communications path (1270) between the substrate (1231) of the first processor element package (1230) and the substrate (1241) of the second processor element package (1240). |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;BEAUSOLEIL, RAYMOND G.;FIORENTINO, MARCO;MCLAREN, MORAY;ASTFALK, GREG;BINKERT, NATHAN LORENZO;FATTAL, DAVID A. |
发明人 |
BEAUSOLEIL, RAYMOND G.;FIORENTINO, MARCO;MCLAREN, MORAY;ASTFALK, GREG;BINKERT, NATHAN LORENZO;FATTAL, DAVID A. |