| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting composition, formable of, by dispenser application, a relatively thick polyimide film (100 μm or more) having heat resistance, electric insulating property and low warping property. <P>SOLUTION: The thermosetting composition includes at least one compound selected from a silicon compound (A) obtained by using a compound (a1) having two or more acid anhydride groups and a monoamine (a2), and a silicon compound (A') obtained by using a compound (a1') having one acid anhydride group and a diamine (a2'). <P>COPYRIGHT: (C)2012,JPO&INPIT |
