发明名称 SUBSTRATE FOR HIGH-SPEED SIGNAL TRANSMISSION
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate for high-speed signal transmission having excellent signal transmission characteristics at high speed. <P>SOLUTION: The substrate for high-speed signal transmission includes a first substrate having a first ground pattern, a first insulation layer formed on both sides of the first ground pattern, and a first conductive pattern formed on the surface of the first insulation layer, a second substrate having a second ground pattern, a second insulation layer formed on both sides of the second ground pattern, and a second conductive pattern formed on the surface of the second insulation layer, and a connection which connects the first conductive pattern of the first substrate and the second conductive pattern of the second substrate while the first substrate and the second substrate face each other. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012142511(A) 申请公布日期 2012.07.26
申请号 JP20110001047 申请日期 2011.01.06
申请人 FUJITSU COMPONENT LTD 发明人 MIZUKAMI KAZUHIRO;KUSATANI TOSHIHIRO
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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