| 摘要 |
<p>A method and apparatus for thermally processing a substrate (140) is described. The apparatus includes a substrate support (104) configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber (100; 300; 400). An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.</p> |
