| 摘要 |
A mold structure for a light-emitting diode (LED) package (20). The mold structure includes a notch (22), which is formed at at least an end portion of a package mold, in which a cavity is formed to mount a LED therein. Furthermore, an electrode lead (23), may be formed at at least an end portion of the package mold and may be closely attached to the package mold, and thus the overall size of a LED package may be reduced. |
