发明名称 LED LIGHTING MODULE
摘要 PURPOSE: A LED lighting module is provided to effectively releasing heat coming from a LED chip by arranging LED heat sink between a metal PCB and LED package. CONSTITUTION: A LED heat sink(230) releases heat coming from a LED chip(226). A LED package(220) composed of a lead frame(222), lead line(224), and cover(228) is located on the top of the LED heat sink. A metal PCB(210) composed of a metal plate(212), insulating layer(214), and circuit pattern(216) is located on the lower part of the LED heat sink and releases heat of the LED heat sink.
申请公布号 KR20120082706(A) 申请公布日期 2012.07.24
申请号 KR20110004148 申请日期 2011.01.14
申请人 NEW OPTICS, LTD. 发明人 PARK, JONG CHUL;JI, JAE GEUN;CHEON, SEUNG HAK;PARK, CHO RONG
分类号 H01L33/64;H01L33/48 主分类号 H01L33/64
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