| 摘要 |
PURPOSE: A package of light emitting diode is provided to effectively prevent heat dissipation by directly transferring heat from a light emitting diode chip to a metal plate. CONSTITUTION: A light emitting diode chip(35) is arranged on a base substrate(31). A lead frame(33) is electrically connected to the light emitting diode chip on the base substrate. A reflection layer(34) is formed on the lead frame whose end is arranged on the end of the reflection layer. A molding member(37) is formed on the light emitting diode chip.
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