发明名称 |
Semiconductor package and method of manufacturing the same |
摘要 |
There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a silicon wafer comprising a first surface and a second surface opposite to the first surface; (b) forming vias through the silicon wafer in its thickness direction; (c) forming wiring patterns on the first surface of the silicon wafer such that the wiring patterns are electrically connected to the vias; (d) bonding a MEMS element wafer comprising MEMS elements onto the second surface of the silicon wafer such that the MEMS elements are electrically connected to the vias; (e) dividing the MEMS element wafer into the respective MEMS elements; (f) bonding a lid having concave portions therein onto the second surface of the silicon wafer such that the respective MEMS elements face a corresponding one of the concave portions; and (g) dicing the lid and the silicon wafer. |
申请公布号 |
US8227909(B2) |
申请公布日期 |
2012.07.24 |
申请号 |
US20100969952 |
申请日期 |
2010.12.16 |
申请人 |
SAKAGUCHI HIDEAKI;HIGASHI MITSUTOSHI;TAGUCHI YUICHI;SHIRAISHI AKINORI;MURAYAMA KEI;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SAKAGUCHI HIDEAKI;HIGASHI MITSUTOSHI;TAGUCHI YUICHI;SHIRAISHI AKINORI;MURAYAMA KEI |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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