PREPARATION METHOD OF APPARATUS FOR RECEIVING WAFER

摘要

PURPOSE: A method for manufacturing a wafer holding device is provided to prevent the damage of a wafer in beforehand due to the reduction of adsorptive power by minutely forming a vacuum hole for adsorbing the wafer. CONSTITUTION: A settling unit(100) is composed of a chuck(110) and a supporting board(120). The supporting board is composed of a supporting board body(121), an external periphery projection(122), a center recess(123), and a settling projection(125). A vacuum offering hole(121a) passing through the center portion of the supporting board body. A guide groove(124) is formed at the corner of the center recess. An installation body(210) is composed of a first installation body(211) and a second installation body(212) connected with an external vacuum pump(220).