MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to improve yield of the semiconductor device by controlling the generation of a void within a mold. CONSTITUTION: A cavity(14a) corresponding to the form either a top mold(14) or a bottom mold(15) is formed. An injection gate(14d) connected with the cavity and a resin forming mold(13) equipped with an air bent are prepared. A plate shaped member equipped with a semiconductor chip is arranged between the top mold and the bottom mold. The top mold and the bottom mold are clamped in the state covering the semiconductor chip with the cavity. A sealing body is formed on the plate shaped member e by injecting a resin for sealing into the cavity from the injection gate.