| 摘要 |
<p>PURPOSE: A molding method and apparatus of an electronic component are provided to simply execute a molding progress of the electronic component by adsorbing a release film to a female mold by using vacuum suction power without forced movement of the release film. CONSTITUTION: A female mold(110) has a cavity(113) and a peripheral part(115) limiting the cavity. A male mold(120) is arranged on the upper side of the female mold. The male mold grips an electronic component(130) by using vacuum suction force. A release film offering part(140) offers a release film(150) between the female mold and the male mold. A first vacuum part(160) offers the vacuum suction power to the release film which is located between the female mold and the male mold. Resin for molding is offered to the cavity. The electronic component is molded by being dipped in the resin for molding.</p> |
