| 摘要 |
<P>PROBLEM TO BE SOLVED: To control the composition of a deposited film in the reactive sputtering caused by the simultaneous discharge of a plurality of targets. <P>SOLUTION: By making different the amounts of reactive gas respectively supplied to targets, a reactive product with reactive gas is sputtered from one target, and a target material is sputtered from the other target. Thus, the composition of the deposited film can be controlled. Further, by executing the sputtering with one target in a poison mode and the other target in a metal mode, a compound consisting of the reactive product and the metal is film-deposited. <P>COPYRIGHT: (C)2012,JPO&INPIT |
