| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board and a manufacturing method of the same which can sufficiently secure electric connection reliability between a pad and a veer. <P>SOLUTION: A pad includes a metal layer exposed on a wiring board, a first metal layer provided between the metal layer exposed on the wiring board and a veer to inhibit diffusion of a metal included in the veer to the metal layer exposed on the wiring board, and a second metal layer provided between the veer and the first metal layer and more resistant to oxidation than the first metal layer. Among the metal layers included in the pad, roughening processing is performed on a top face of the second metal layer and side faces and a face on the second metal layer side of the pad are covered by an insulation layer, a face of the pad on the side of the metal layer exposed on the wiring board is exposed on the insulation layer. On the insulation layer, an opening for exposing the roughened face of the second metal layer is formed. On the opening, the veer connected to the roughened face of the second metal layer is formed. On a top face of the insulation layer, wiring connected to the veer is provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
