SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To solve problems occurring in an LED device in which a connection electrode is formed directly on an encapsulation member that it is difficult to manufacture the device because the connection electrode formed on a substrate is transferred to the encapsulation member side, and a fluorescent material is deteriorated because a gas such as a moisture vapor is transmitted through the encapsulation material when the encapsulation member is resin.

SOLUTION: A white reflection member 17, an LED element 16, a fluorescent material layer 12 and a glass 11 are laminated on a contact electrode 18. The LED element 16 is provided with bumps 15 and connected with the connection electrode 18. The white reflection member 17 together with the glass 11 encapsulates the LED element 16.

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