THERMOELECTRIC MODULE WITH MEANS FOR COMPENSATING FOR A THERMAL EXPANSION

摘要

The invention relates to a thermoelectric module (1) that extends in a longitudinal direction (9), comprising an outer pipe (2), an inner pipe (3) arranged within the outer pipe (2), and an intermediate space (4) arranged between said pipes. At least one first strip-shaped structure (5) and a second strip-shaped structure (7) are provided. Said first strip-shaped structure (5) extends from a first connection (6) on the inner pipe (3) and the second strip-shaped structure (7) extends from a second connection (12) on the outer pipe (2) in respective opposite directions (11) in at least one circumferential direction (8) or in the longitudinal direction (9) and at least partly form an overlap (10) at least in the circumferential direction (8) or in the longitudinal direction (9), at least one pair of semiconductor elements (13) being arranged in the region of the overlap (10).