| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent variations in the shape and the dimension, simplify the manufacturing process, and reduce the manufacturing cost as a substrate support jig is formed by integral molding. <P>SOLUTION: A substrate is supported from below by support members and is held so as to maintain a flat surface. Then, electronic components are mounted on an upper side surface of the substrate. When the substrate is held, the support members, each of which is formed by integrally molding a plate part made of a foamed elastic material with multiple support pins integrally formed on one surface of the plate part so as to protrude, are used. Part of the multiple support pins are cut off to support a lower side of the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
