| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrodeless plating device capable of forming a plated coating film of excellent film quality. <P>SOLUTION: The electrodeless plating device includes a substrate support part 46 for supporting a substrate W, a plating liquid storage part for storing a plating liquid supplied to a surface of the substrate W, a plating liquid supply pipe for supplying the plating liquid from the plating liquid storage part, toward the surface of the substrate W supported by the substrate support part 46, a plating liquid delivery nozzle provided in the plating liquid supply pipe, and delivering the plating liquid onto the surface of the substrate W, a substrate temperature control member 48' provided in a reverse face side of the substrate W supported by the substrate support part 46, to control a temperature of the substrate W, and a moving mechanism for generating relative elevation movement between the substrate temperature control member 48' and the substrate W. The substrate temperature control member 48' controls the temperature of the substrate W, by regulating a distance with respect to the substrate W by the moving mechanism. <P>COPYRIGHT: (C)2012,JPO&INPIT |
