发明名称 CHEMICALLY AMPLIFIED POSITIVE TYPE PHOTORESIST COMPOSITION FOR THICK FILM AND PRODUCTION METHOD OF THICK-FILM RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a chemically amplified positive type photoresist composition for thick films capable of forming a thick-film resist pattern having high resolution and dimension controllability, and having favorable rectangularity, and to provide a production method of a thick-film resist pattern using such composition. <P>SOLUTION: The photoresist composition comprises an acid generator (A) including a cationic moiety represented by a general formula (a1) and an anionic moiety represented by a general formula (a2), and a resin (B) whose alkali solubility increases by the action of an acid. R<SP POS="POST">1a</SP>to R<SP POS="POST">3a</SP>each independently represents an alkoxy group, an alkyl carbonyl group, an alkyl carbonyloxy group, an alkyl oxycarbonyl group or the like. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012137741(A) 申请公布日期 2012.07.19
申请号 JP20110245494 申请日期 2011.11.09
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIMIZU TAKAHIRO;WASHIO YASUSHI;ANDO TOMOYUKI;KOSHIYAMA ATSUSHI
分类号 G03F7/004;C09K3/00;G03F7/039;H01L21/027;H05K3/00;H05K3/18 主分类号 G03F7/004
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