PURPOSE: A semiconductor package including a lead frame is provided to improve support performance by implementing a two side inner lead frame which supports the semiconductor chip on both sides thereof. CONSTITUTION: A molding film(260) molds a semiconductor chip(230). A lead frame supports the semiconductor chip. The lead frame includes the first lead frames(202) and the second lead frames(204). The first lead frames are extended from a left side to a right side of the semiconductor chip. The second lead frames are extended from the right side to the left side of the semiconductor chip.
