ELECTRONIC DEVICE AND METHOD OF FORMING THE SAME

摘要

A method of forming an electronic device having a metal piece and a plastic piece adhered to the metal piece is provided. The method includes the step of forming an adhering part on a surface of the metal piece which at least partially covers the surface thereof. The method also includes the step of forming the plastic piece by injection molding using a plastic material which is adhered to the metal piece with the adhering part connecting the plastic piece and the metal piece.